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this is information on a product in full production. march 2013 docid017195 rev 3 1/40 40 stts3000 2.3 v memory module temperature sensor datasheet - production data features ? stts3000 is a 2.3 v memory module temperature sensor forward compatible with jedec standard ts3000 and backward compatible with stts424 ? operating temperature range: ? ?40 c to +125 c ? single supply voltage: 2.3 v to 3.6 v ? temperature sensor resolution: programmable (9-12 bits) 0.25 c (typ)/lsb - (10-bit) default ? temperature sensor accuracy (max): ? 1 c from +75 c to +95 c ? 2 c from +40 c to +125 c ? 3 c from ?40 c to +125 c ? adc conversion time: 125 ms (max) at default resolution (10-bit) ? typical operating supply current: 160 a ? temperature hysteresis selectable set points from: 0, 1.5, 3, 6.0 c ? two-wire smbus/i 2 c - compatible serial interface ? supports up to 400 khz transfer rate ? does not initiate clock stretching ? supports smbus timeout 25 ms - 35 ms ? spike suppression filters on the two-wire bus inputs ? voltage hysteresis per i 2 c specs on the two- wire bus inputs ? 2 mm x 3 mm tdfn8, height: 0.80 mm (max) ? compliant to jedec mo-229, wced-3 ? rohs compliant , halogen-free tdfn8 2 mm x 3 mm (max height 0.80 mm) www.st.com
contents stts3000 2/40 docid017195 rev 3 contents 1 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 serial communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 device type identifier (dti) code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2.1 a0, a1, a2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2.2 v ss (ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2.3 sda (open drain) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2.4 scl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2.5 event (open drain) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2.6 v dd (power) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 smbus/i 2 c communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2 smbus/i 2 c slave sub-address decoding . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.3 smbus/i 2 c ac timing consideration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 temperature sensor registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4.1 capability register (read-only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.2 configuration register (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.2.1 event thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.2.2 interrupt mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.2.3 comparator mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.2.4 shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.2.5 event output pin functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.3 temperature register (read-only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.3.1 temperature format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 4.4 alarm temperature trip registers (read/write) . . . . . . . . . . . . . . . . . . . . . . 23 4.4.1 alarm window trip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.4.2 critical trip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 4.5 manufacturer id register (read-only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.6 device id and device revisi on id register (read-only) . . . . . . . . . . . . . . . 26 4.7 temperature resolution register (read/write) . . . . . . . . . . . . . . . . . . . . . . 27
docid017195 rev 3 3/40 stts3000 contents 4.8 smbus timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6 dc and ac parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8 part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 9 package marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
list of tables stts3000 4/40 docid017195 rev 3 list of tables table 1. signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 2. ac characteristics of stts3000 for smbus and i 2 c compatibility timings. . . . . . . . . . . . . 13 table 3. temperature sensor registers summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 4. pointer register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 5. pointer register select bits (t ype, width, and default values). . . . . . . . . . . . . . . . . . . . . . . . 15 table 6. capability register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 7. capability register bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 8. configuration register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 9. configuration register bit definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 table 10. hysteresis as applied to temperature movement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 11. legend for figure 9: event output boundary timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table 12. temperature register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 13. temperature register coding examples (for 10 bits ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 14. temperature register bit definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 table 15. temperature trip register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 16. alarm temperature upper boundary trip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 17. alarm temperature lower boundary trip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 18. critical temperature trip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 19. manufacturer id register (read-onl y). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 20. device id and device revision id register (read-on ly). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 table 21. temperature resolution register (tres) (read/write) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 22. tres details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 23. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 table 24. operating and ac measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 table 25. dc/ac characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 table 26. tdfn8 ? thin dual flat, no-lead (2 mm x 3 mm) mechanical data (dn) . . . . . . . . . . . . . . . 32 table 27. parameters for landing pattern - tdfn8 package (dn) . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 table 28. carrier tape dimensions tdfn8 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 table 29. reel dimensions for 8 mm carrier tape - tdfn8 package . . . . . . . . . . . . . . . . . . . . . . . . . 36 table 30. ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 table 31. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
docid017195 rev 3 5/40 stts3000 list of figures list of figures figure 1. logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 2. tdfn8 connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 3. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 4. smbus/i 2 c write to pointer register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 5. smbus/i 2 c write to pointer register, followed by a read da ta word. . . . . . . . . . . . . . . . . . . 11 figure 6. smbus/i 2 c write to pointer register, followed by a write data word . . . . . . . . . . . . . . . . . . 11 figure 7. smbus/i 2 c timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 8. hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 9. event output boundary timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 10. ac measurement i/o wa veform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 figure 11. tdfn8 ? thin dual flat, no-lead (2 mm x 3 mm) package outline (dn) . . . . . . . . . . . . . . . . 32 figure 12. landing pattern - tdfn8 package (dn) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 figure 13. carrier tape for tdfn8 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 figure 14. reel schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 figure 15. dn package topside marking information (tdfn8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
description stts3000 6/40 docid017195 rev 3 1 description the stts3000 is targeted for dimm modules in mobile personal computing platforms (laptops), servers and other industrial applications. the thermal sensor (ts) in the stts3000 is complia nt with the jedec specificatio n ts3000 which defines memory module thermal sensors requirements for mobile platforms. the ts provides space as well as cost savings for mobile and server platform dual inline memory modules (dimm) manufacturers, as it is packaged in the compact 2 mm x 3 mm 8-lead tdfn package with a thinner maximum height of 0.80 mm. the dn package is compliant to jedec mo- 229, variation wced-3. the digital temperature sensor has a programmable 9-12 bit analog-to-digital converter (adc) which monitors and digitizes the temperatur e to a resolution of up to 0.0625 c. the default resolution is 0.25 c/lsb (10-bit). the typical accuracies over these temperature ranges are: 2 c over the full temperature measurement range of ?40 c to 125 c 1 c in the +40 c to +125 c active temperature range, and 0.5 c in the +75 c to +95 c monitor temperature range the temperature sensor in the stts3000 is spec ified for operating at supply voltages from 2.3 v to 3.6 v. operating at 3.3 v, the typical supply current is 160 a (includes smbus communication current). the onboard sigma-delta adc converts the measured temperature to a digital value that is calibrated in c. for fahrenheit applications, a lookup table or conversion routine is required. the stts3000 is factory-calibrated and requires no external components to measure temperature. the digital temperature sensor has user-p rogrammable registers that provide the capabilities for dimm temperat ure-sensing applicat ions. the open drain event output pin is active when the monitoring temperature exceeds a programmable limit, or it falls above or below an alarm window. the user has the option to set the event output as a critical temperature output. this pin can be configured to operate in either a comparator mode for thermostat operation or in interrupt mode.
docid017195 rev 3 7/40 stts3000 serial communications 2 serial communications the stts3000 has a simple 2-wire smbus/i 2 c-compatible digital serial interface which allows the user to access the data in the temperature register at any time. it communicates via the serial interface with a master controller wh ich operates at speeds of up to 400 khz. it also gives the user easy acce ss to all of the stts3000 registers in order to customize device operation. 2.1 device type identifier (dti) code the jedec temperature sensor has its own unique i 2 c address which ensures that there are no compatibility or data translation issu es. the dti code is the unique 4-bit address ?0011? figure 1. logic diagram 1. sda and event are open drain. note: see section 2.2: pin descriptions on page 9 for details. table 1. signal names pin symbol description direction 1 a0 serial bus address selection pin. can be tied to v ss or v dd . input 2 a1 serial bus address selection pin. can be tied to v ss or v dd . input 3 a2 serial bus address selection pin. can be tied to v ss or v dd . input 4v ss supply ground 5sda (1) 1. sda and event are open drain. serial data input/output 6 scl serial clock input 7 event (1) event output pin. open dr ain and active-low. output 8v dd supply power (2.3 v to 3.6 v) ai12261 sda (1) v dd stts3000 v ss scl event (1) a 2 a 1 a 0
serial communications stts3000 8/40 docid017195 rev 3 figure 2. tdfn8 connections (top view) 1. sda and event are open drain. figure 3. block diagram 1 sda (1) gnd scl event (1) a1 a0 v dd a2 ai12262 2 3 4 8 7 6 5 temperature sensor adc address pointer register 1 2 3 4 5 6 capability register configuration register temperature register upper register lower register critical register manufacturer id device id/ revision logic control comparator timing smbus/i 2 c interface 7 8 v dd scl sda a0 a1 a2 v ss event ai12278b
docid017195 rev 3 9/40 stts3000 serial communications 2.2 pin descriptions 2.2.1 a0, a1, a2 a2, a1, and a0 are selectable address pins for the 3 lsbs of the i 2 c interface address. they can be set to v dd or gnd to provide 8 unique address selections. 2.2.2 v ss (ground) this is the reference for th e power supply. it must be connected to system ground. 2.2.3 sda (open drain) this is the serial data input/output pin. 2.2.4 scl this is the serial clock input pin. 2.2.5 event (open drain) this output pin is open drain and active-low. 2.2.6 v dd (power) this is the supply voltage pin, and ranges from 2.3 v to 3.6 v.
operation stts3000 10/40 docid017195 rev 3 3 operation the stts3000 continuously monitors the ambient temperature and updates the temperature data register. temperature data is latched internally by the device and may be read by software from the bus host at any time. the smbus/i 2 c slave address selection pins allow up to 8 such devices to co-exist on the same bus. this means that up to 8 memory modules can be supported, given that each module has one such slave device address slot. after initial power-on, the configuration register s are set to the defaul t values. the software can write to the configuration register to set bits per the bit definitions in section 3.1: smbus/i 2 c communications . 3.1 smbus/i 2 c communications the registers in this device are selected by t he pointer register. at power-up, the pointer register is set to ?00?, which is the capability register location. the po inter register latches the last location it was set to . each data register falls into one of three types of user accessibility: 1. read-only 2. write-only, and 3. write/read same address a write to this device always includes the address byte and the pointer byte. a write to any register other than the pointer register, requires two data bytes. reading this device is achieved in one of two ways: ? if the location latched in the pointer register is correct (most of the time it is expected that the pointer register points to one of t he read temperature registers because that is the data most frequently read), then the read can simply consist of an address byte, followed by retrieval of the two data bytes. ? if the pointer register needs to be set, then an address byte, pointer byte, repeat start, and another address byte accomplishes a read. the data byte transfers the msb first. at the end of a read, this device can accept either an acknowledge (ack) or no acknowledge (no ack) status from the master. the no ack status is typically used as a si gnal for the slave that the master has read its last byte. this device subsequently takes up to 125 ms to measure the temperature for the default temperature resolution. note: stts3000 does not initiate clock stretching which is an optional i 2 c bus feature.
docid017195 rev 3 11/40 stts3000 operation figure 4. smbus/i 2 c write to pointer register figure 5. smbus/i 2 c write to pointer register, followed by a read data word figure 6. smbus/i 2 c write to pointer register, followed by a write data word ai12264 11 99 0 start by master address byte pointer byte ack by stts3000 ack by stts3000 0 1 1 a2 a1 a0 r/w 0 0 0 0 0 d2 d1 d0 scl sda ai12265 1919 ack by master no ack by master stop cond. by master d7 d6 d5 d4 d3 d2 d1 d0 msb data byte lsb data byte 11 99 0 start by master address byte pointer byte ack by stts3000 ack by stts3000 0 1 1 a2 a1 a0 r/w 0 0 0 0 0 d2 d1 d0 scl sda d9 d10 d11 d12 d13 d14 d15 d8 19 repeat start by master ack by stts3000 0 0 1 1 a2 a1 a0 r/w address byte scl (continued) sda (continued) ai14012 1919 ack by stts3000 no ack by stts3000 stop cond. by master d7 d6 d5 d4 d3 d2 d1 d0 msb data byte lsb data byte 11 99 0 start by master address byte pointer byte ack by stts3000 ack by stts3000 0 1 1 a2 a1 a0 r/w 0 0 0 0 0 d2 d1 d0 scl scl (continued) sda d8 d9 d10 d11 d12 d13 d14 d15 sda (continued)
operation stts3000 12/40 docid017195 rev 3 3.2 smbus/i 2 c slave sub-address decoding the physical address of the temperature sensor is binary 0 0 1 1 a2 a1 a0 rw, where a2, a1, and a0 are the three slave sub-address pins, and the lsb ?rw? is the read/write flag. 3.3 smbus/i 2 c ac timing consideration in order for this device to be both smbus- and i 2 c-compatible, it complies to a subset of each specification. th e requirements which enable this device to co-exist with devices on either an smbus or an i 2 c bus include: ? the smbus minimum clock frequency is required. ? the smbus timeout is maximum 35 ms. figure 7. smbus/i 2 c timing diagram v ih v ih v il v il s cl s da note: p s t a nd s for s top a nd s s t a nd s for s ta rt t buf t low t hd: s ta t hd:di t r t f t s u:dat t high t s u: s ta t hd:dat t s u: s to p s p s a i12266 b
docid017195 rev 3 13/40 stts3000 operation table 2. ac characteristics of stts3000 for smbus and i 2 c compatibility timings symbol parameter min max units f scl smbus/i 2 c clock frequency 10 400 khz t high clock high period 600 ? ns t low (1) 1. stts3000 does not initiate clock stretching which is an i 2 c bus optional feature. clock low period 1300 ? ns t r (2) 2. guaranteed by design and characteri zation, not necessarily tested. clock/data rise time ? 300 ns t f (2) clock/data fall time 20 300 ns t su:dat data in setup time 100 ? ns t hd:di data in hold time 0 ? ns t hd:dat data out hold time 200 900 ns t su:sta (3) 3. for a restart condition, or following a write cycle. repeated start condition setup time 600 ? ns t hd:sta hold time after (repeated) star t condition. after this period, the first clock cycl e is generated. 600 ? ns t su:sto stop condition setup time 600 ? ns t buf bus free time between stop (p) and start (s) conditions 1300 ? ns t timeout bus timeout 25 35 ms
temperature sensor registers stts3000 14/40 docid017195 rev 3 4 temperature sensor registers the temperature sensor component is comprise d of various user-programmable registers. these registers are required to write their corresponding addresses to the pointer register. they can be accessed by writing to their respective addresses (see table 3 ). pointer register bits 7 - 4 must always be written to '0' (see table 4 ). this must be maintained, as not setting these bits to '0' may keep the de vice from performing to specifications. the main registers include: ? capability register (read-only) ? configuration register (read/write) ? temperature register (read-only) ? alarm temperature trip registers (read/write) , including ? alarm temperature upper boundary, ? alarm temperature lower boundary, and ? critical temperature. ? manufacturer id register (read-only) ? device id and device revision id register (read-only) ? temperature resolution register (tres) (read/write) see table 5 on page 15 for pointer register selection bit details. note: registers beyond the specified (00-08) are reserved for stmicroelectronics internal use only, for device test modes in product manufac turing. the registers must not be accessed by the user (customer) in the system applicatio n or the device may not perform according to specifications. table 3. temperature sensor registers summary address (hex) register name power-on default not applicable address pointer undefined 00 capability b-grade only 0x006f 01 configuration 0x0000 02 alarm temperature upper boundary trip 0x0000 03 alarm temperature lower boundary trip 0x0000 04 critical temperature trip 0x0000 05 temperature undefined 06 manufacturer?s id 0x104a 07 device id/revision 0x0200 08 temperature resolution register 0x01
docid017195 rev 3 15/40 stts3000 temperature sensor registers 4.1 capability register (read-only) this 16-bit register is read-only, and provid es the ts capabilities which comply with the minimum jedec ts3000 specifications (see table 6 and table 7 on page 16 ). the stts3000 resolution is programmable via writing to pointer 08 register. the power-on default value is 0.25 c/lsb (10-bit). table 4. pointer register format msb lsb bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 0 0 0 0 p3 p2 p1 p0 pointer/register select bits table 5. pointer register select bits (type, width, and default values) p3 p2 p1 p0 name register description width (bits) type (r/w ) default state (por) 0000capa capab ility b-grade only 16 r 00 6f 0001conf configuration 16 r/w 00 00 0010u pper alarm temperature upper boundary trip 16 r/w 00 00 0011loweralarm temperature lower boundary trip 16 r/w 00 00 0100criticalcritical temperature trip 16 r/w 00 00 0101temp temperature 16 r undefined 0110manu manufacturer id 16 r 10 4a 0111id device id/revision 16 r 02 00 1000tres temperature resolution register 8 r/w 01 table 6. capability register format bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 rfu rfu rfu rfu rfu rfu rfu rfu bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 evsd tmout v hv tres1 tres0 wider range higher precision alarm and critical trips por - 0x006f h 0000000 0 0110111 1
temperature sensor registers stts3000 16/40 docid017195 rev 3 table 7. capability register bits bit definition 0 basic capability ? 0 = alarm and critical trips turned off. ? 1 = alarm and critical trips turned on. 1 accuracy ? 0 = accuracy 2 c over the active range and 3 c over the monitoring range (c-grade). ? 1 = high accuracy 1 c over the active range and 2 c over the monitoring range (b-grade) (default) 2 range width ? 0 = values lower than 0 c will be clamped and represented as binary value '0'. ? 1 = temperatures below 0 c can be read and the sign bit will be set accordingly. 4:3 temperature resolution ? 00 = 9 bit, 0.5 c/lsb ? 01 = 10 bit, 0.25 c/lsb - default resolution ? 10 = 11 bit, 0.125 c/lsb ? 11 = 12 bit, 0.0625 c/lsb 5 (v hv ) high voltage support for a0 (pin 1) ? 1 = stts3000 supports a voltage up to 10 volts on the a0 pin - (default) 6 tmout - bus timeout support (for temperature sensor only) ?0 = t timeout is supported in the range of 10 to 60 ms ? 1 = default for stts3000-smbus compatible 25 ms - 35 ms 7 evsd - event behavior upon shutdown ? 0 = default for stts3000.the event output freezes in its current state when entering shutdown. upon enteri ng shutdown, the event output remains in the previous state until the next thermal data conversion occurs, or possibly sooner if event is programmed for comparator mode. ? 1 = event output is deasserted (not driven) when entering shutdown and remains deasserted upon exit from shutdown until the next thermal sample is taken or possibly sooner if event is programmed for comparator mode. 15:8 reserved these values must be set to '0'.
docid017195 rev 3 17/40 stts3000 temperature sensor registers 4.2 configuration re gister (read/write) the 16-bit configuration register stores various configuration modes that are used to set up the sensor registers and configure according to application and jedec requirements (see table 8 on page 17 and table 9 on page 18 ). 4.2.1 event thresholds all event thresholds use hysteresis as programmed in register address 0x01 (bits 10 through 9) to be set when they de-assert. 4.2.2 interrupt mode the interrupt mode allows an ev ent to occur where software may write a '1' to the clear event bit (bit 5) to de- assert the event in terrupt output until the next trigger condition occurs. 4.2.3 comparator mode the comparator mode enables the device to be used as a thermostat. reads and writes on the device registers do not affect the event output in comparator mode. the event signal remains asserted until temperature drops outside the range or is re-programmed to make the current temperature ?out of range?. 4.2.4 shutdown mode the stts3000 features a shutdown mode which disables all power-consuming activities (e.g. temperature sampling operations), and leaves the serial interface active. this is selected by setting shutdown bit (bit 8) to '1'. in this mode, the devices consume the minimum current (i shdn ), as shown in table 25 on page 30 . note: bit 8 cannot be set to '1' while bits 6 and 7 (the lock bits) are set to '1'. the device may be enabled for continuous operat ion by clearing bit 8 to '0'. in shutdown mode, all registers may be read or written to. power recycling also clears this bit and returns the device to continuous mode as well. table 8. configuration register format bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 rfu rfu rfu rfu rfu hysteresis hysteresis shutdown mode bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 critical lock bit alarm lock bit clear event event output status event output control critical event only event polarity event mode por = 0x0000 h 000 0 0 000 000 0 0 000
temperature sensor registers stts3000 18/40 docid017195 rev 3 table 9. configuration register bit definitions bit definition 0 event mode ? 0 = comparator output mo de (this is the default). ? 1 = interrupt mode; when either of t he lock bits (bit6 or bit7) is set, this bit cannot be altered until it is unlocked. 1 event polarity (1) the event polarity bit controls the active state of the event pin. the event pin is driven to this state when it is asserted. ? 0 = active-low (this is the default). requires a pull-up resistor to set the inactive state of the open-drain output. the power to the pull-up resi stor should not be greater than v dd + 0.2 v. active state is logical ?0?. ? 1 = active-high. the active state of the pin is then logical ?1?. 2 critical event only ? 0 = event output on alarm or critical temperature event (this is the default). ? 1 = event only if the temperat ure is above the value in the cr itical temperat ure register (t a > t crit ); when the alarm window lock bit (bit6) is set, this bit cannot be altered until it is unlocked. 3 event output control ? 0 = event output disabled (this is the default). ? 1 = event output enabled; when either of the lock bits (bit 6 or bit7) is set, this bit cannot be altered until it is unlocked. 4 event status (read-only) (2) ? 0 = event output condition is not being asserted by this device. ? 1 = event output condition is being asserted by this device via the alarm window or critical trip event. 5 clear event (write-only) (3) ? 0 = no effect. ? 1 = clears the active event in interrupt mode. th e pin is released and does not assert until a new interrupt condition occurs. 6 alarm window lock bit ? 0 = alarm trips are not locked and can be altered (this is the default). ? 1 = alarm trip register settings cannot be altered. th is bit is initially cleared. when set, this bit returns a logic '1' and remains locked until cleared by an internal power-on reset. these bits can be written to with a single write, and do not require double writes. 7 critical trip lock bit ? 0 = critical trip is not locked and can be altered (this is the default). ? 1 = critical trip register settings cannot be altered. this bit is initially cleared. when set, this bit returns a logic '1' and remains locked until cleared by an internal power-on reset. these bits can be written to with a single write, and do not require double writes. 8 shutdown mode ? 0 = ts is enabled, continuous conversion (this is the default). ? 1 = shutdown ts when the shutdown, device, and a/d c onverter are disabled in order to save power. no event conditions are asserted; when either of the lock bits (bit6 or bit7) is set, then this bit cannot be altered until it is unlocked. it can be cleared at any time.
docid017195 rev 3 19/40 stts3000 temperature sensor registers figure 8. hysteresis 1. t h = value stored in the alarm tem perature upper boundary trip register 2. t l = value stored in the alarm temperature lower boundary trip register 3. hys = absolute value of selected hysteresis 10:9 hysteresis enable (see figure 8 and table 10 ) ? 00 = hysteresis is disabled (default) ? 01 = hysteresis is enabled at 1.5 c ? 10 = hysteresis is enabled at 3 c ? 11 = hysteresis is enabled at 6 c hysteresis applies to all limits when the temperatur e is dropping below the threshold so that once the temperature is above a given threshol d, it must drop below the threshol d minus the hysteresis in order to be flagged as an interrupt event. note that hysteresis is also appli ed to the event pin functionality. when either of the lock bits is set, these bits cannot be altered. 15:11 reserved for future use. these bits always read ?0? and writing to them has no effect. for future compatibility, all rfu bits must be programmed as ?0?. 1. as this device is used in dimm (memory modules) applicatio ns, it is strongly recommended that only the active-low polarity (default) is used. this provides full compatibility with the stts424. this is the recommended configuration for the stts3000. 2. the actual incident causing the event can be determined from the read temperature register. interrupt events can be cleared by writing to the clear event bit (writing to this bit has no effect on overall device functioning). 3. writing to this register has no effect on overall device func tioning in comparator mode. when read, this bit always returns a logic '0' result. table 9. configuration regist er bit definitions (continued) bit definition below window bit above window bit t h - hys t l - hys t h t l ai12270 table 10. hysteresis as applied to temperature movement below alarm window bit above alarm window bit temperature slope temperature threshold temperature slope temperature threshold sets falling t l - hys rising t h clears rising t l falling t h - hys
temperature sensor registers stts3000 20/40 docid017195 rev 3 4.2.5 event output pin functionality the stts3000 event pin is an open drain output that requires a pull-up to v dd on the system motherboard or integrated into the master controller. event has three operating modes, depending on configuration settings and any current out-of-limit conditions. these modes are interrupt, comparator or critical. in interrupt mode the event pin remains asserted until it is released by writing a ?1? to the ?clear event? bit in the status register. t he value to write is independent of the event polarity bit. in comparator mode the event pin clears itself when the erro r condition that caused the pin to be asserted is removed. in critical mode the event pin is asserted only if the measured temperature exceeds the critical limit. once the pin has been asserted , it remains asserted until the temperature drops below the critical limit minus hysteresis. figure 9 on page 21 illustrates the operation of the different modes over time and temperature. when the hysteresis bits (bits 10 and 9) ar e enabled, hysteresis may be used to sense temperature movement around trigger points. for example, when using the ?above alarm window? bit (temperature register bit 14, see table 12 on page 22 ) and hysteresis is set to 3 c, as the temperature rises, bit 14 is set (bit 14 = 1). the temperature is above the alarm window and the temperature register contains a value that is greater than the value set in the alarm temperature upper boundary register (see table 16 on page 24 ). if the temperature decreases, bit 14 remains set until the measured temperature is less than or equal to the value in the alarm temperature upper boundary register minus 3 c (see figure 8 on page 19 and table 10 on page 19 for details. similarly, when using the ?below alarm window? bit (temperature register bit 13, see table 12 on page 22 ) is set to '0'. the temperature is equal to or greater than the value set in the alarm temperature lower boundary register (see table 17 on page 24 ). as the temperature decreases, bit 13 is set to '1' when the value in the temperature register is less than the value in the alarm temperature lower boundary register minus 3 c (see figure 8 on page 19 and table 10 on page 19 for details. the device retains the previous state when entering the shutdown mode. if the device enters the shutdown mode while the event pin is low, the shutdown current increases due to the additional event output pull-down current.
docid017195 rev 3 21/40 stts3000 temperature sensor registers figure 9. event output boundary timings systems that use the active high mode for event output must be wired point-to-point between the stts3000 and the sensing controlle r. wire-or configurations should not be used with active high event output since any device pu lling the event output signal low masks the other devices on the bus. also note th at the normal state of event output in active high mode is a ?0? which constantly dr aws power through the pull-up resistor. table 11. legend for figure 9: event output boundary timings note event output boundary conditions event output t a bits comparator interrupt critical 15 14 13 1t a t lower hlh000 2t a < t lower - t hys llh001 3t a > t upper llh010 4t a t upper - t hys hlh000 5t a t crit lll100 6t a < t crit - t hys lhh010 7 when t a t crit and t a < t crit - t hys , the event output is in comparator mode and bit 0 of the configuration register (interrupt mode) is ignored. comparator t crit t upper t lower t a t lower - t hys interrupt s/w int. clear critical event output (active low) t upper - t hys t crit - t hys t upper - t hys t lower - t hys 1213357 4642 ai12271 note:
temperature sensor registers stts3000 22/40 docid017195 rev 3 4.3 temperature regi ster (read-only) this 16-bit, read-only register stores the temp erature measured by the internal band gap ts as shown in table 12 . when reading this register, the msbs (bit 15 to bit 8) are read first, and then the lsbs (bit 7 to bit 0) are read. the result is the current-sensed temperature. the data format is 2s complement with one lsb = 0.25 c for the default resolution. the msb has a 128 c resolution. the trip status bits represent the internal temp erature trip detection, and are not affected by the status of the event or configuration bits (e.g. event output control or clear event). if neither of the above or below values are set (i.e . both are 0), then the temperature is exactly within the user-defined alarm window boundaries. 4.3.1 temperature format the 16-bit value used in the trip point set and temperature read-back registers is 2s complement, with the lsb equal to 0.0625 c (see table 12 ). for example: 1. a value of 019c h represents 25.75 c, 2. a value of 07c0 h represents 124 c, and 3. a value of 1e74 h represents ?24.75 c all unused resolution bits are set to zero. the msb has a resolution of 128 c. the stts3000 supports programmable resolutions (9-12 bits) which is 0.5 to 0.0625 c/lsb. the default is 0.25 c/lsb (10 bits) programmable. the upper 3 bits indicate trip status based on the current temperature, and are not affected by the event output status. table 12. temperature register format sign msb lsb (1) bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 (2) bit 0 (3) flag bit flag bit flag bit sign 128 64 32 16 8 4 2 1 0.5 0.25 0.125 0.0625 c/lsb above critical input (4) above alarm window (4) below alarm window (4) temperature (default - 10 bit) 0 0 flag bits example hex value of 07c0 corresponds to 124 c (10-bit) 0 0 0 0 0 11111000 0 0 0 07c0 h flag bits example hex value of 1d80 corresponds to ?40 c (10-bit) 0 0 0 1 1 10110000 0 0 0 1d80 h 1. bit 2 is lsb for default 10-bit mode. 2. depending on status of the resolution register, bit 1 may display 0.125 c value. 3. depending on status of the resolution register, bit 0 may display 0.0625 c value. 4. see table 14 for explanation.
docid017195 rev 3 23/40 stts3000 temperature sensor registers a 0.25 c minimum granularity is supported in all registers. examples of valid settings and interpretation of temperature register bits for 10-bit (0.25 c) default resolution are provided in table 13 . 4.4 alarm temperature trip registers (read/write) the stts3000 alarm trip registers provide for 11-bit data in 2s compliment format. the data provides for one lsb = 0.25 c. all unused bits in these registers are read as '0'. the stts3000 has three temperature trip registers (see table 15 ): ? alarm temperature upper boundary trip ( table 16 ), ? alarm temperature lower boundary trip ( table 17 ), and ? critical temperature trip ( table 18 ). note: if the upper or lower boundary trip values are being altered in-system, all interrupts should be turned off until a known state can be obtaine d to avoid superfluous interrupt activity. table 13. temperature register coding examples (for 10 bits) b15:b0 (binary) value units xxx0 0000 0010 11xx +2.75 c xxx0 0000 0001 00xx +1.00 c xxx0 0000 0000 01xx +0.25 c xxx0 0000 0000 00xx 0 c xxx1 1111 1111 11xx ?0.25 c xxx1 1111 1111 00xx ?1.00 c xxx1 1111 1101 11xx ?2.25 c table 14. temperature register bit definitions bit definition with hysteresis = 0 13 below (temperatu re) alarm window ? 0 = temperature is equal to or above the alarm window lower boundary temperature. ? 1 = temperature is below the alarm window. 14 above (temperature) alarm window. ? 0 = temperature is equal to or below the alarm window upper boundary temperature. ? 1 = temperature is above the alarm window. 15 above critical trip ? 0 = temperature is below t he critical temperature setting. ? 1 = temperature is equal to or abov e the critical temperature setting.
temperature sensor registers stts3000 24/40 docid017195 rev 3 4.4.1 alarm window trip the device provides a comparison window with an upper temperature trip point in the alarm upper boundary register, and a lower trip point in the alarm lower boundary register. when enabled, the event output is triggered when ever entering or exiting (crossing above or below) the alarm window. 4.4.2 critical trip the device can be programmed in such a way that the event output is only triggered when the temperature exceeds the critical trip point. the critical temperature setting is programmed in the critical temperature regist er. when the temperature sensor reaches the critical temperature value in this register, the device is automatically placed in comparator mode, which means that the critic al event output cannot be cleared by using software to set the clear event bit. table 15. temperature trip register format p3 p2 p1 p0 name register description width (bits) type (r/w ) default state (por) 0010u pper alarm temperature upper boundary 16 r/w 00 00 0011loweralarm temperature lower bou ndary 16 r/w 00 00 0100criticalcritical temperature 16 r/w 00 00 table 16. alarm temperature upper boundary trip sign msb lsb (1) bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit (2) 1 bit (3) 0 000 alarm temperature upper boundary trip 00 1. bit 2 is lsb for default 10-bit mode. 2. depending on status of the resolution register, bit 1 may display 0.125 c value. 3. depending on status of the resolution register, bit 0 may display 0.0625 c value. table 17. alarm temperature lower boundary trip sign msb lsb (1) bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit (2) 1 bit (3) 0 000 alarm temperature lower boundary trip 00 1. bit 2 is lsb for default 10-bit mode. 2. depending on status of the resolution register, bit 1 may display 0.125 c value. 3. depending on status of the resolution register, bit 0 may display 0.0625 c value.
docid017195 rev 3 25/40 stts3000 temperature sensor registers note: in all temperature register formats bit 0 and bit 1 are used when the resolution is more than 10 bits. these registers show temperature data for the default 10 bits. table 18. critical temperature trip sign msb lsb (1) bit 15 bit 14 bit 13 bit 12 bit 11 bit 10 bit 9 bit 8 bit (2) 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit (3) 1 bit (4) 0 000 critical temperature trip 00 1. bit 2 is lsb for default 10-bit mode. 2. if critical trip lockout bit (bit 7 of configuration register in table 9 ) is set, then this register becomes read-only. 3. depending on status of the resolution register, bit 1 may display 0.125 c value. 4. depending on status of the resolution register, bit 0 may display 0.0625 c value.
temperature sensor registers stts3000 26/40 docid017195 rev 3 4.5 manufacturer id register (read-only) the manufacturer?s id (programmed value 104ah) in this register is the stmicroelectronics identification provided by the peripheral co mponent interconnect special interest group (pcisig). 4.6 device id and device revisi on id register (read-only) the device id and device revision id are mainta ined in this register. the register format is shown in table 20 . revision numbers are incremented whenever an update of the device is made. the current device id and revision id value is 0200 h. table 19. manufacturer id register (read-only) bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 00010000 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 01001010 table 20. device id and device revision id register (read-only) bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 00000010 device id bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 00000000 device revision id
docid017195 rev 3 27/40 stts3000 temperature sensor registers 4.7 temperature resolution register (read/write) with this register a user can program the te mperature sensor resolution from 9-12 bits as shown below. the power-on default is always 10 bit (0.25 c/lsb). the selected resolution is also reflected in bi ts (4:3) (tres1:tres0) of the capability register. the default value is 01 for tres register. 4.8 smbus timeout the stts3000 supports the smbus timeout feature which is turned on by default. if the host holds scl low for more than t timeout (max), the stts3000 resets itself and releases the bus. this feature is supported even when the device is in shutdown mode and when the device is driving sda low. table 21. temperature resolution register (tres) (read/write) bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 00000001 resolution selection register resolution bits table 22. tres details resolution register bits bit1 bit0 c/lsb bits co nversion time (max) 0 0 0.5 9 65 ms 0 1 0.25 10 125 ms (default) 1 0 0.125 11 250 ms 1 1 0.0625 12 500 ms
maximum ratings stts3000 28/40 docid017195 rev 3 5 maximum ratings stressing the device above the ratings listed in the absolute maximum ratings table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affe ct device reliability. table 23. absolute maximum ratings symbol parameter value unit t stg storage temperature ?65 to 150 c t sld (1) 1. reflow at peak temperature of 260 c. the time above 255 c must not exceed 30 seconds. lead solder temperature for 10 seconds 260 c v io input or output voltage a0 v ss ? 0.3 to 10.0 v others v ss ? 0.3 to 6.5 v v dd supply voltage v ss ? 0.3 to 6.5 v i o output current 10 ma p d power dissipation 320 mw ja thermal resistance 87.4 c/w
docid017195 rev 3 29/40 stts3000 dc and ac parameters 6 dc and ac parameters this section summarizes the operating measurement conditions, and the dc and ac characteristics of the de vice. the parameters in the dc and ac characteristics tables that follow, are derived from tests performed under the measurement conditions summarized in table 24 . designers should check that the operatin g conditions in their circuit match the operating conditions when relying on the quoted parameters. figure 10. ac measurement i/o waveform table 24. operating and ac measurement conditions parameter conditions unit v dd supply voltage 2.3 to 3.6 v operating temperature ?40 to 125 c input rise and fall times 50 ns load capacitance 100 pf input pulse voltages 0.2v dd to 0.8v dd v input and output timing reference voltages 0.3v dd to 0.7v dd v input levels input and output timing reference levels 0.8 * v dd 0.2 * v dd 0.7 * v dd 0.3 * v dd ai14011
dc and ac parameters stts3000 30/40 docid017195 rev 3 table 25. dc/ac characteristics sym description test condition (1) min typ (2) max unit v dd supply voltage 2.3 3.3 3.6 v i dd v dd supply current (no load) f = 400 khz 160 300 a i dd1 shutdown mode supply current ts shutdown 1 3 a i ili input leakage current (scl, sda) v in = v ss or v dd 5 a i ilo output leakage current v out = v ss or v dd , sda in hi-z 5 a v por power on reset (por) threshold v dd falling edge 1.75 v b-grade accuracy for corresponding range 2.3 v v dd 3.6 v +75 c < t a < +95 (active range) 0.5 1.0 c +40 c < t a <+ 125 (monitor range) 1.0 2.0 c ?40 c < t a < +125 (full range) 2.0 3.0 c resolution 0.5 0.25 0.0625 c/lsb 91012bits t conv conversion time 10-bit - default 125 ms smbus/i 2 c interface v ih input logic high scl, sda, a0-a2 0.7v dd v dd + 1 v v il input logic low scl, sda, a0-a2 ?0.5 0.3v dd v c in (3) smbus/i 2 c input capacitance 5 pf f scl smbus/i 2 c clock frequency 10 400 khz t timeout smbus timeout 25 35 ms v hv a0 high voltage v hv v dd + 4.8 v 7 10 v v ol1 low level voltage, event i ol = 2.1 ma 0.4 v v ol2 low level voltage, sda i ol = 2.1 ma 0.4 v i ol = 6 ma 0.6 v t sp (3) spike suppression pulse width of spikes that must be suppressed by the input filter input filter on scl and sda 50 ns v hyst input hysteresis (scl, sda) 0.05v dd v 1. guaranteed operating temperature: t a = ?40 c to 125 c; v dd = 2.3 v to 3.6 v (except where noted). 2. typical numbers taken at v dd = 3.3 v, t a = 25 c. 3. verified by design and characterization, not necessarily tested on all devices
docid017195 rev 3 31/40 stts3000 package mechanical data 7 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark.
package mechanical data stts3000 32/40 docid017195 rev 3 figure 11. tdfn8 ? thin dual flat, no-lead (2 mm x 3 mm) package outline (dn) note: jedec mo-229, variation wced-3 proposal note: jedec mo-229, variation wced-3 proposal 8089094_a table 26. tdfn8 ? thin dual flat, no-le ad (2 mm x 3 mm) mechanical data (dn) sym mm inches min typ max min typ max a 0.70 0.75 0.80 0.028 0.030 0.031 a1 0.00 0.00 0.05 0.000 0.000 0.002 a3 0.20 0.008 b 0.20 0.25 0.30 0.008 0.010 0.012 d 1.95 2.00 2.05 0.077 0.079 0.081 d2 1.35 1.40 1.45 0.053 0.055 0.057 e 2.95 3.00 3.05 0.116 0.118 0.120 e2 1.25 1.30 1.35 0.049 0.051 0.053 e 0.50 0.020 l 0.30 0.35 0.40 0.012 0.014 0.016 ddd 0.08 0.003
docid017195 rev 3 33/40 stts3000 package mechanical data the landing pattern recommendations per the jedec proposal for the tdfn8 package (dn) are shown in figure 12 . the preferred implementation with wide corner pads enhances device centering during assembly, but a narrower option is defined for modules with tight routing requirements. figure 12. landing pattern - tdfn8 package (dn) e/2 e/2 e2 k k e2/2 e2/2 e2 d2/2 d2 d2/2 l l e b b b2 b4 k2 k2 k2 e3 e3 e4 ai14000
package mechanical data stts3000 34/40 docid017195 rev 3 table 27 lists variations of landing pattern implementations, ranked as ?preferred? and minimum acceptable? based on the jedec proposal. table 27. parameters for landing pattern - tdfn8 package (dn) parameter description dimension min nom max d2 heat paddle width 1.40 - 1.60 e2 heat paddle height 1.40 - 1.60 e3 heat paddle centerline to contact inner locus 1.00 - - l contact length 0.70 - 0.80 k heat paddle to contact keepout 0.20 - - k2 contact to contact keepout 0.20 - - e contact centerline to contact centerline pitch for inner contacts - 0.50 - b contact width for inner contacts 0.25 - 0.30 e2 landing pattern centerline to oute r contact centerline, ?minimum acceptable? option (1) -0.50- b2 corner contact width, ?minimum acceptable option? (1) 0.25 - 0.30 e4 landing pattern centerline to outer contact centerline, ?preferred? option (2) -0.60- b4 corner contact width, ?preferred? option (2) 0.45 - 0.50 1. minimum acceptable option to be used w hen routing prevents preferred width contact. 2. preferred option to be used when possible.
docid017195 rev 3 35/40 stts3000 package mechanical data figure 13. carrier tape for tdfn8 package t k 0 p 1 a 0 b 0 p 2 p 0 center lines of cavity w e f d top cover tape user direction of feed am0 3 07 3 v1 table 28. carrier tape di mensions tdfn8 package package w d e p 0 p 2 fa 0 b 0 k 0 p 1 tunit bulk qty tdfn8 8.00 + 0.30 ?0.10 1.50 +0.10/ ?0.00 1.75 0.10 4.00 0.10 2.00 0.10 3.50 0.05 2.30 0.10 3.20 0.10 1.10 0.10 4.00 0.10 0.30 0.05 mm 3000
package mechanical data stts3000 36/40 docid017195 rev 3 figure 14. reel schematic note: the dimensions given in table 29 incorporate tolerances that cover all variations on critical parameters. a d b f u ll r a di us t a pe s lot in core for t a pe s t a rt 2.5mm min.width g me asu red at h ub c n 40mm min. acce ss hole at s lot loc a tion t am0492 8 v1 table 29. reel dimensions for 8 mm carrier tape - tdfn8 package a (max) b (min) c d (min) n (min) g t (max) 180 mm (7-inch) 1.5 mm 13 mm 0.2 mm 20.2 mm 60 mm 8.4 mm + 2/?0 mm 14.4 mm
docid017195 rev 3 37/40 stts3000 part numbering 8 part numbering table 30. ordering information scheme for other options, or for more in formation on any aspect of th is device, please contact the st sales office nearest you. example: stts3000 b 2 dn 3 f device type stts3000 accuracy grade b: maximum accuracy 75 c to 95 c = 1 c voltage (minimum) 2 = 2.3 v - 3.6 v part package dn = tdfn8 (0.80 mm max height) temperature 3 = ?40 c to 125 c shipping method f = ecopack ? package, tape & reel packing
package marking stts3000 38/40 docid017195 rev 3 9 package marking figure 15. dn package topside marking information (tdfn8) 1. device name ts30 = stts3000 2. temperature grade and package b = b-grade 2 = minimum operating voltage of 2.3 v dn = 0.80 mm tdfn package 3. traceability codes ai13907c ts30 (1) xxxx (3) b2dn (2)
docid017195 rev 3 39/40 stts3000 revision history 10 revision history table 31. document revision history date revision changes 01-mar-2010 1 initial release. 16-jun-2010 2 updated figure 3 , 15 ; added reel information ( figure 14 , table 29 ); document status upgraded to full datasheet. 20-mar-2013 3 updated table 7 , figure 15 , and ta ble 30 .
stts3000 40/40 docid017195 rev 3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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